Product Ordering Guide - EXTERNAL
Sample Part Number (Selected from areas below with white on black)
1 S C 0150 3 1 5 N
Selections (PSI & Inches)
Pressure & Resistance Oper. Range Bridge Sensitivity Constraint (glass) Shipping (die) Cover (package) Gel (package)
# Series PSI Resist. # Temp. (°C) # Type PSI Sensitivity* Output** # Series Type Thick. Hole # Type # Type Hgt Wid Hole # Type
1 AP301 100-1K 5K Ω S -40 to 150 O Open 5 3000 75 1 3000 (std) Gage .020" .025" T Sawn wafer on tape 1 Cyl. ceramic - sm hole* .125" .33" .020" 1 Clear*
2 AP301 100-1K 3.5K Ω H 1/2 Open 15 2000 150 2 3000 Gage .035" .048" W Die in waffle pack 5 Sq. ceramic - sm hole** .090" .25" .09" 2 Black*
3 3000 5-100 5K Ω C Closed 30 1000 150 3 AP 301 (std) Gage .035" .025" N Wafer not sawn 6 Cyl. ceramic - short*** .125" .25" .189" 3 Fluorogel*
4 3000 5-100 3.5K Ω 50 0500 125 4 AP 301 Gage .035" .048" Substrate (package) 7 Cyl. ceramic - tall*** .25" .25" .189" N No gel**
5 5000 2K-10K 5K Ω 100 0300 150 5 All (std) Abs. .020"   # Type
6 5000 2K-10K 3.5K Ω 300 0100 150 6 All Abs. .035"   1 Ceramic SMD (.30"x.30"x.025"; ga)* *no gel; ceramic substrate only *silicone
500 0070 175 7 AP301 Gage .020" .025" 2 Ceramic SMD (.30"x.30"x.025"; abs)* **no gel ** all covers
750 0050 188 8 3000 Gage .020" .048" 3 Ceramic (.49"x.58"x.040"; gage)** ***ceramic SMD substrates only
1K 0030 150 N None*      
3K 0008 120 *Ceramic SMD Considerations
5K 0005 125 *3000 and AP301 series only Half open/half closed and closed bridges only
7.5K 0004 150 5-300 psi:  no restrictions except cannot accept solvent-resistant gel for 5 - 100 psi
10K 0003 150 500-1,000 psi:  gage must be top side pressure only and no gel
2,000-10,000 psi:  absolute only and no gel
*microvolts/volt/psi (µV/V/psi) **Ceramic Considerations
**millivolts (mV) @ 5 volts 5 to 1,000 psi only; gage only; compensated for span & offset only
Selections (Bar & Millimeters)
Cover (package)
Pressure & Resistance Oper. Range Bridge Sensitivity Constraint (glass) Shipping (die) # Type Hgt Wid Hole Gel (package)
# Series Bar Resist. # Temp. (°C) # Type Bar Sensitivity* Output** # Series Type Thick. Hole # Type 1 Cyl. ceramic - sm hole* 3.2mm 8.4mm .51mm # Type
1 AP301 7 - 69 5K Ω S -40 to 150 O Open 0.34 3000 75 1 3000 (std) Gage .51mm .64mm T Sawn wafer on tape 5 Sq. ceramic - sm hole** 2.3mm 6.4mm 2.3mm 1 Clear*
2 AP301 7 - 69 3.5K Ω H 1/2 Open 1 2000 150 2 3000 Gage .89mm 1.2mm W Die in waffle pack 6 Cyl. ceramic - short*** 3.2mm 6.4mm 4.8mm 2 Black*
3 3000 .34 - 7 5K Ω C Closed 2.1 1000 150 3 AP 301 (std) Gage .89mm .64mm N Wafer not sawn 7 Cyl. ceramic - tall*** 6.4mm 6.4mm 4.8mm 3 Fluorogel*
4 3000 .34 - 7 3.5K Ω 3.4 0500 125 4 AP 301 Gage .89mm 1.2mm Substrate (package) N No gel**
5 5000 138-689 5K Ω 6.9 0300 150 5 All (std) Abs. .51mm   # Type *no gel; ceramic substrate only
6 5000 138-689 3.5K Ω 20.7 0100 150 6 All Abs. .89mm   1 Ceramic SMD (7.6mmx7.6mmx.64mm; ga)* **no gel *silicone
34.5 0070 175 7 AP301 Gage .51mm .64mm 2 Ceramic SMD (7.6mmx7.6mmx.64mm; abs)* ***ceramic SMD substrates only ** all covers
51.7 0050 188 8 3000 Gage .51mm 1.2mm 3 Ceramic (12.4mmx14.7mmx1mm; gage)**
68.9 0030 150 N None*      
207 0008 120 *Ceramic SMD Considerations
345 0005 125 *3000 and AP301 series only Half open/half closed and closed bridges only
517 0004 150 5-300 psi:  no restrictions except cannot accept solvent-resistant gel for 5 - 100 psi
689 0003 150 500-1,000 psi:  gage must be top side pressure only and no gel
2,000-10,000 psi:  absolute only and no gel
*microvolts/volt/psi (µV/V/psi) **Ceramic Considerations
**millivolts (mV) @ 5 volts 5 to 1,000 psi only; gage only; compensated for span & offset only
Instructions
Pressure & Resistance Specify pressure range and resistance value - other ranges and values available upon request.
Operating Range Specify "S" - the operating temperature range of our sensors is from -40°c to 150°c.
Bridge Specify bridge type:  Open (6 contacts), Half Open (5 contacts) or Closed (4 contacts).
Sensitivity Specify sensitivity at FSO (full-scale output) in microvolts/volt/psi (µV/V/psi) - other sensitivities available upon request.
Constraint Specify constraint type, thickness and hole size - other constraints available upon request.
Shipping or Substrate Specify shipping preference or substrate type - other substrates available upon request.  (Substrates for packages only.)
Cover Specify die cover type, height, diameter/width and hole size - other covers available upon request.  (For packages only.)
Gel Specify gel type - other gels available upon request.  (For packages only.)